SKU 11003Accesories & Cables
800 Point Solderless Breadboard ? Full Size Prototyping Board
₹74
01 — About
What it does
The 800 Point Solderless Breadboard is a full-size prototyping board with twice the capacity of standard 400-point models. It features four power rails and ample space for complex circuits with multiple ICs and components.
Key features
- 800 tie points for larger circuits
- 4 power rails (2 top, 2 bottom)
- 63 rows of 5 connected columns
- Dual binding posts (on some models)
- Standard 2.54mm pitch
- Reusable solderless design
- Full-size format for complex projects
Good to know
- Same usage notes as 400-point version
- Four power rails allow multiple voltage domains
- Binding posts provide convenient power entry
- Can be interlocked with other breadboards
- Ideal for circuits with multiple chips
02 — Datasheet
Specifications
- Tie Points
- 800
- Rows
- 63
- Power Rails
- 4
- Pitch
- 2.54mm
- Accepted Wire
- 22-26 AWG
- Dimensions
- 165mm x 55mm x 9mm